Who am I?

Gyongsu Lee, Ph.D.

Location: San Jose, California, United States
Email: gyongsu.lee@gmail.com
LinkedIn: linkedin.com/in/gyongsulee

Executive Summary

Visionary technology leader with over two decades of expertise in SoC and ASIC architecture, wireless communications, and semiconductor innovation. Proven ability to scale and lead high-impact engineering teams, delivering complex silicon solutions for mobile, IoT, and automotive markets. Award-winning contributor at Samsung, driving global advancements in GNSS, Wi-Fi, Bluetooth, and multimedia system-on-chip (SoC) technologies. Adept at aligning technical execution with business goals through cross-functional collaboration and forward-thinking strategy.

Education

  • KAIST: Ph.D. in Electrical Engineering – Thesis: Architecture Analysis and Design of the Platform-Based Wireless Communication Systems (Advisor: Prof. Sin-Chong Park)
  • KAIST: M.S. in Electrical Engineering
  • KAIST: B.S. in Electrical Engineering
  • UC Berkeley: Engineering Leadership Professional Program (ELPP)

Professional Experience

Samsung Electronics – San Jose, CA
Senior Director | Jul 2017 – Present

  • Led the Location ASIC (GNSS HW) group for Samsung Exynos modem SoCs.
  • Oversaw the development of DSP and SoC for GPS, Glonass, Beidou, Galileo, and NavIC.
  • Coordinated global engineering teams and SoC validation.
  • Recipient of the System LSI President’s Award.

Newracom Inc. – Orange County, CA
Vice President, SoC & System Research Group | 2014 – 2017

  • Product leader for low-power mobile combo SoCs (Wi-Fi & Bluetooth).
  • Directed IEEE 802.11ah Long-Range Wi-Fi SoC development.
  • Business development for mobile Wi-Fi markets.

Samsung Electronics – Korea / US
Principal Engineer | 2012 – 2014

  • Project Lead for “The Hardware Implementation of ATSC 3.0.”
  • Contributed to UHD pedestrian TV broadcast system standardization in the US and Korea.
  • Samsung’s representative at MHL consortium (alternative HDMI standard).
  • Research Planner, DMC R&D Center.

Advanced Digital Chips Inc. – Seoul, Korea
Principal Engineer & SoC Development Team Leader | 2000 – 2012

  • Led development and delivery of custom SoC platforms for Samsung, SK Telecom, and others.
  • Directed Wi-Fi market development with G2 Microsystems.
  • Managed RFID and ultra-low power sensor SoC government projects.

Major Projects

  • Mobile Combo SoC (Wi-Fi & Bluetooth) – Product leadership and business development (2014–2017)
  • Korean Wi-Fi Market Expansion – Supported Samsung S1 and others (2009–2012)
  • Ultra-Low Power Sensor Network SoC – With ETRI (2010–2012)
  • 13.56 MHz RFID Reader SoC – Multi-standard reader for national ID (2007–2008)

Technical Expertise

  • SoC Design: SOC/DSP RTL, Embedded CPU, hardware IP, FPGA prototyping
  • Languages: Verilog HDL, VHDL, C/C++, Python, JavaScript, Tcl
  • Wireless Systems: Wi-Fi, Bluetooth, Zigbee, RFID
  • Broadcast Systems: GNSS, ATSC 3.0, MHL, HDMI

Patents

  • US Patent 20150071375 – Transmitter, Receiver and Controlling Method Thereof
  • Korea Patent 1020000011948 – Detection of the Code Group of W-CDMA
  • Korea Patent 1019990026430 – Synchronization Apparatus for CDMA
  • Korea Patent 1019980051667 – Jammer for CDMA Cellular Phone

Publications

  • Journals: IEE Electronics Letters, IEICE Transactions
  • Conferences: IP-SOC, ITC-CSCC, ICC, WWC, IEEE VTC
  • Full list available upon request

Awards

  • Samsung System LSI President’s Award
  • Best Performance – Overseas SoC R&D Lab

Languages

  • Korean: Native or Bilingual
  • English: Professional Working Proficiency